Description
The device is CMOS Synchronous Dynamic RAM
organized as 4,194,304 words x 4 bits x 4 banks, 2,097,152 words x 8 bits x 4 banks and
1,048,576 words x 16 bits x 4 banks, respectively. It is fabricated with an advanced
submicron CMOS technology and designed to operate from a singly 3.3V only power supply. It
is packaged in JEDEC standard pinout and standard plastic TSOP package.
Features
Single 3.3V ( ) power supply
High speed clock cycle time :
6 / 7 / 8 only for x16 organization
7L / 8H only for x4 / x8 organization
PC100(8H), PC133(7L)
Fully synchronous with all signals
referenced to a positive clock edge
Programmable CAS Iatency (2, 3)
Programmable burst length (1, 2, 4,
8 & Full page)
Programmable wrap sequence
(Sequential/Interleave)
Automatic precharge and controlled
precharge
Auto refresh and self refresh modes
Quad Internal banks controlled by
A12 & A13 (Bank Select)
Each Bank can operate simultaneously
and independently
VTTL compatible I/O interface
Random column access in every cycle
X4 / X8 / X16 organization
Input/Output controlled by DQM(X4 /
X8) ,LDQM and UDQM(X16)
4,096 refresh cycles/64ms
Burst termination by burst stop and
precharge command
Burst read/single write option
|